Influence of Selected Factors on Thermal Parameters of the Components of Forced Cooling Systems of Electronic Devices

The paper presents some investigation results on the properties of forced cooling systems dedicated to electronic devices. Different structures such systems, including Peltier modules, heat sinks, fans, and thermal interfaces, are considered. Compact models formulated. These take into account a multipath transfer make it possible compute waveforms device’s internal temperature at selected values power dissipated in device. analytical formulas describing dependences resistance devices co-operating with considered cooled device feeding module speed airflow caused by fan proposed. correctness proposed is verified experimentally wide range powers operating different configurations used system.